Halnziye HY2312 Thermal Putty Test Shows 13.483 W/mK
Igor's Lab tests show Halnziye's HY2312 thermal putty achieves 13.483 W/mK, a major improvement over the HY2310, though performance varies with thickness.
Halnziye's HY2312 thermal putty has been tested, achieving a bulk thermal conductivity of 13.483 W/mK. According to Igor's Lab, the median effective thermal conductivity was 11.52 W/mK, significantly outperforming the older HY2310 model.
A complete Bond Line Thickness (BLT) measurement series was conducted using a TIMA5 NEXT analyzer, rather than a single favorable measurement point. The test aimed to evaluate the material's performance across the range of thicknesses typical for thermal putty applications, such as bridging gaps on memory chips and voltage converters.
Measured Performance and Comparison
The testing revealed that the HY2312's advantage over the HY2310 grows as the bond line gets thicker. The report provides a regression model comparison of area-specific thermal resistance (in mm²K/W) at various thicknesses.
| Bond Line Thickness | HY2312 Resistance | HY2310 Resistance |
|---|---|---|
| 500 µm | ~55.2 mm²K/W | ~80.8 mm²K/W |
| 1000 µm | ~92.3 mm²K/W | ~140.2 mm²K/W |
| 2000 µm | ~166.5 mm²K/W | ~259.1 mm²K/W |
| 3000 µm | ~240.6 mm²K/W | ~377.9 mm²K/W |
This positions the HY2312 at the top of the tested comparison for applications involving larger gaps. The bulk thermal conductivity is approximately 60.2 percent higher than the HY2310, while the combined interface resistance is about 15.3 percent lower.
Material Composition and Behavior
The tested sample came in a container with a screw cap and an additional inner lid. The putty was uniformly pink and macroscopically homogeneous, with no free liquid layer observed upon opening.
Microscopy, however, revealed a heterogeneous structure containing visible agglomerates. Nine measured agglomerates ranged from 11.52 to 53.95 micrometers in size. The largest agglomerate, just under 54 µm, represented about 22 percent of the smallest tested bond line of 250 µm. The analysis notes these nine observations do not constitute a statistically reliable particle-size distribution.
An energy-dispersive X-ray spectroscopy (EDX) analysis of a selected zone indicated a local composition of 48.8 percent zinc, 35.3 percent oxygen, 13.5 percent silicon, and 2.4 percent hydrogen. The report clarifies this is a local analysis, not the global composition, and the exact formulation cannot be established from this data alone.
During testing, the putty could be portioned and distributed cleanly. It remained shape-stable before compression but deformed significantly as test heads approached, a behavior that allows it to accommodate height differences.
Test Limitations and Practical Considerations
The report from Igor's Lab distinguishes between bulk thermal conductivity and effective thermal conductivity, which includes losses at the contact surfaces. At a 250 µm bond line, the HY2312 measured an effective conductivity of 8.05 W/mK, despite the regression-derived bulk value of 13.48 W/mK. Interfaces have a stronger relative effect at small bond lines.
The manufacturer's package claim of "more than 12 W/mK" is deemed plausible for the tested sample, given the derived bulk value. The testers warn, however, that this should not be treated as a constant practical conductivity for every bond-line thickness, as the manufacturer's own measurement method is not established by this independent test.
Package labeling was noted as inconsistent. The front of the container in question prints "HY2012," while the back lists variants including HY2312 in pink, HY2212 in blue, HY2512 in green, and HY2612 in gray. The tester specifically warned against the green HY2612 variant, which reportedly had almost disintegrated on its own and was declined for testing.
The test does not establish the long-term aging behavior of the HY2312 putty.
Source: Igor's Lab