Splave One Thermal Paste Review: High Conductivity, High
A new review finds the Splave One thermal paste has a high material conductivity of 7.19 W/mK but suffers from significant contact resistance, making it
The Splave One thermal paste achieves an apparent material conductivity of 7.19 W/mK, according to a new review from Igor's Lab. However, its high combined contact resistance of 6.95 mm²K/W means it loses much of that advantage in thin layers, making it most effective under high mounting pressure.
Material Analysis and Performance
The review, which compared the paste to the Halnziye HY-P17, used TIMA5 multi-thickness measurements, microscopy, and LIBS analysis. While the Splave One's material conductivity is higher, its contact resistance is more than double that of the HY-P17. In thin bond lines, the contact component dominates total thermal resistance.
For the Splave One, the analyzer estimates the contact component at approximately 66.7 percent at a 25 µm bond line thickness. For the HY-P17, the figure is about 41.5 percent. At the lower regular measurement limit, only around 30.2 percent of the Splave One's apparent conductivity remains as effective conductivity, compared to 64.4 percent for the HY-P17.
| Metric | Splave One | Halnziye HY-P17 |
|---|---|---|
| Apparent Material Conductivity (λapp) | 7.19 ± 0.26 W/mK | 6.726 ± 0.051 W/mK |
| Combined Contact Resistance | 6.95 ± 1.178 mm²K/W | 2.632 ± 0.272 mm²K/W |
| Regular Lower Bond-Line-Thickness (BLT) | 9.882 µm | 25.01 µm |
| Pressure at Regular Lower BLT | ~100.2 kPa | ~6.0 kPa |
| Effective Conductivity (λeff) at 400 µm | 6.566 W/mK | ~6.458 W/mK |
Mechanical Properties and Application
The paste is designed for high mechanical loads and very thin layers under sufficient mounting pressure. Microscopy shows a dense, compact filler structure with particles between 3.30 and 15.97 µm. Under pressure, the filler framework can reorganize, allowing the paste to achieve a regular bond-line thickness of just under 10 µm.
During application, the paste remains on the surface and can be spread with the included spatula. It is described as more stable than very soft standard pastes, but not dry or crumbly. Achieving its optimal thin layer requires significant pressure, ranging from 38 to 42 kPa across much of the measurement range, rising to approximately 100.2 kPa at the thinnest point.
Composition and Target Use Case
LIBS analysis identified the paste's composition by weight as 41.8 percent aluminum, 27.1 percent oxygen, 17.1 percent zinc, 11.5 percent silicon, and 2.5 percent hydrogen. The review states this is consistent with "a highly filled, oxide-based thermal paste with a plausible silicone-containing matrix" and shows no signs of being electrically conductive.
The paste's origins are linked with extreme overclocking and direct-die applications. The reviewer notes it is formulated for scenarios with "high mounting pressure, very high heat flux densities, and as little thermal ballast as possible between the silicon and the cooler." Consequently, it is deemed suitable for Direct-Die, bench, and extreme-overclocking setups that can provide 100 kPa or more of pressure.
Comparison and Practical Implications
For most practical installations in the 25 to 200 µm range, the Halnziye HY-P17 remains thermally superior due to its lower contact resistance. The reviewer states, HY-P17 remains thermally superior in the practically relevant range from 25 to 200 µm because it combines lower contact resistance with consistently high material conductivity.
The Splave One only catches up at much thicker layers, surpassing the HY-P17's effective conductivity at 400 µm. However, the review points out that a thicker paste layer is normally not the objective in practical installation. For coolers with low surface pressure, particularly in mobile designs, the Splave One's properties are less readily usable.
